Reliability Optimum Design
EECraftsman technical team members provide customers with circuit board reliability optimization services to effectively avoid the adverse impact on the reliability of electronic equipment due to improper printed circuit board design in the case of correct circuit schematic design.
Specifically include the following aspects:
1, Ground optimization design: In electronic equipment, grounding is an important method to control interference. Provide optimal design for the system, shell ground (shield ground), digital ground (logical) and analog ground in the customer's electronic equipment, such as: single point grounding and multi-point grounding, digital circuit and analog circuit separation, thick ground wire, the ground wire to form a closed loop road.
2, Electromagnetic compatibility optimization: EECraftsman technical team members to provide customers with EMC optimization design, so that it can still be coordinated and effective in a variety of electromagnetic environments, both to suppress a variety of external interference, but also to reduce the electronic equipment itself on other electronic equipment electromagnetic interference, such as: reasonable wire width, correct wiring strategy.
3, Inhibit reflection interference: EECraftsman technical team members to provide customer products to inhibit reflection interference optimization services, inhibit the reflection interference that appears in the printed line terminal, such as: terminal matching, decoupling capacitor configuration, etc.
4, Printed circuit board size and device layout optimization: EECraftsman technical team members to provide customer products with PCB size and layout optimization, such as: in order to obtain good anti-noise effect, the clock input of the generator, crystal oscillator and CPU are easy to produce noise, to be close to each other; Devices that are easy to produce noise, small current circuits, large current circuits, etc., should be as far away from logic circuits as possible.
5. Thermal design optimization: EECraftsman technical team members provide thermal design optimization services for customer products, aiming to effectively reduce the temperature rise of printed circuits, so that the failure rate of devices and equipment is significantly reduced. Such as: reduce power consumption from both hardware and software, select devices with small heat, and temperature compensation and control for temperature-sensitive devices; The devices on the same printed board should be arranged as far as possible according to the size of their heat and the degree of heat dissipation, and the devices with small heat or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed at the upper stream (entrance) of the cooling air flow. Devices with large heat output or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed at the downstream of the cooling stream; In the horizontal direction, the high-power devices are arranged as close as possible to the edge of the printed board in order to shorten the heat transfer path; In the vertical direction, the high-power devices are arranged as close as possible to the printed board, so as to reduce the influence of these devices on the temperature of other devices when working; The device that is more sensitive to temperature is best placed in the lowest temperature area (such as the bottom of the device), do not place it directly above the heating device, and multiple devices take horizontal staggered layout.
